Kusukela emlandweni wokuthuthukiswa kwe-chip, isiqondiso sokuthuthukiswa kwe-chip isivinini esikhulu, imvamisa ephezulu, ukusetshenziswa kwamandla okuphansi.Inqubo yokukhiqiza i-chip ikakhulukazi ihlanganisa ukuklama kwe-chip, ukukhiqizwa kwama-chip, ukukhiqizwa kokupakisha, ukuhlolwa kwezindleko nezinye izixhumanisi, phakathi kwazo inqubo yokukhiqiza ama-chip iyinkimbinkimbi kakhulu.Ake sibheke inqubo yokukhiqiza ama-chip, ikakhulukazi inqubo yokukhiqiza ama-chip.
Owokuqala ukwakhiwa kwe-chip, ngokuya ngezidingo zokuklama, "iphethini" ekhiqiziwe.
1, impahla eluhlaza ye-wafer ye-chip
Ukwakheka kwe-wafer kuyi-silicon, i-silicon icwengisiswa yisihlabathi se-quartz, i-wafer iyingxenye ye-silicon iyahlanzwa (99.999%), bese i-silicon ehlanzekile yenziwe ibe yinduku ye-silicon, eba yinto ye-quartz semiconductor yokwenza isekethe ehlanganisiwe. , ucezu luyisidingo esikhethekile sewafa yokukhiqiza i-chip.Uma i-wafer iba mncane, izindleko zokukhiqiza ziba zincane, kodwa ziba phezulu izidingo zenqubo.
2.I-wafer enamathela
I-wafer enamathela ingamelana ne-oxidation kanye nezinga lokushisa, futhi impahla iwuhlobo lwe-photoresistance.
3, ukuthuthukiswa kwe-wafer lithography, ukucwiliswa
Le nqubo isebenzisa amakhemikhali azwela ukukhanya kwe-UV, okuwenza athambe.Ukuma kwe-chip kungatholakala ngokulawula isikhundla se-shading.Ama-wafer e-silicon ahlanganiswe ne-photoresist ukuze ancibilike ekukhanyeni kwe-ultraviolet.Yilapho i-shading yokuqala ingasetshenziswa khona, ukuze ingxenye yokukhanya kwe-UV ihlakazwe, okungase kugezwe nge-solvent.Ngakho-ke konke okunye kufana nesimo somthunzi, okuyilokho esikufunayo.Lokhu kusinika ungqimba lwe-silica esiludingayo.
4,Engeza ukungcola
Ama-ion afakwa ku-wafer ukuze kukhiqizwe ama-semiconductors e-P kanye no-N ahambisanayo.
Inqubo iqala ngendawo eveziwe ku-silicon wafer bese ifakwa engxubeni yama-ion amakhemikhali.Inqubo izoshintsha indlela i-dopant zone ewuqhuba ngayo ugesi, ivumele i-transistor ngayinye ukuthi ivule, ivale noma iphathe idatha.Ama-chips alula angasebenzisa isendlalelo esisodwa kuphela, kodwa ama-chips ayinkimbinkimbi ngokuvamile anezendlalelo eziningi, futhi inqubo iphindaphindiwe kaninginingi, ngezingqimba ezihlukene ezixhunywe ngefasitela elivuliwe.Lokhu kufana nomgomo wokukhiqiza webhodi le-PCB lesendlalelo.Ama-chips ayinkimbinkimbi kakhulu angase adinge izendlalelo eziningi ze-silica, ezingafinyelelwa ngokusebenzisa i-lithography ephindaphindiwe kanye nenqubo engenhla, ukwakha isakhiwo se-three-dimensional.
Ukuhlolwa kwe-5.Wafer
Ngemva kwezinqubo ezimbalwa ezingenhla, i-wafer yakha i-lattice yezinhlamvu.Izici zikagesi zohlamvu ngalunye zihlolwe ngendlela 'yokulinganisa inaliti'.Ngokuvamile, inani lezinhlamvu ze-chip ngayinye likhulu, futhi kuyinqubo eyinkimbinkimbi kakhulu ukuhlela imodi yokuhlola iphinikhodi, edinga ukukhiqizwa okukhulu kwamamodeli anezicaciso ze-chip ezifanayo ngangokunokwenzeka ngesikhathi sokukhiqiza.Uma ivolumu iphezulu, izindleko ezilinganiselwe ziyancipha, okungesinye sezizathu ezenza ama-chip ajwayelekile ashibhe kangaka.
6. Encapsulation
Ngemuva kokwakhiwa kwe-wafer, iphinikhodi iyalungiswa, futhi amafomu ahlukahlukene okupakisha akhiqizwa ngokuvumelana nezidingo.Lesi yisizathu sokuthi kungani i-chip core efanayo ingaba namafomu ahlukene okupakisha.Isibonelo: I-DIP, i-QFP, i-PLCC, i-QFN, njll. Lokhu kunqunywa kakhulu imikhuba yohlelo lwabasebenzisi, indawo yohlelo lokusebenza, ifomu lemakethe nezinye izici ezizungezile.
7. Ukuhlola nokupakishwa
Ngemuva kwenqubo engenhla, ukukhiqizwa kwama-chip sekuqediwe, lesi sinyathelo esokuhlola i-chip, ukususa imikhiqizo enesici, nokupakishwa.
Okungenhla okuqukethwe okuhlobene kwenqubo yokukhiqiza ama-chip ehlelwe yi-Create Core Detection.Ngethemba ukuthi izokusiza.Inkampani yethu inonjiniyela abangochwepheshe kanye neqembu lemboni elite, linama-laboratories ajwayelekile ama-3, indawo yaselabhorethri ingaphezu kwamamitha-skwele ayi-1800, ingenza ukuqinisekiswa kokuhlolwa kwezingxenye ze-elekthronikhi, ukuhlonza i-IC kweqiniso noma okungamanga, ukukhetha impahla yokuklama umkhiqizo, ukuhlaziya ukwehluleka, ukuhlolwa komsebenzi, ukuhlolwa kwezinto ezingenayo zasembonini kanye netheyiphu namanye amaphrojekthi okuhlola.
Isikhathi sokuthumela: Jun-12-2023