Isihloko esisodwa siyaqonda |Siyini isisekelo sokukhethwa kwenqubo yokucubungula indawo embonini ye-PCB

• 1. Umoya oshisayo uyisicaba (spray tin)

Inqubo evamile yenqubo yokulinganisa komoya oshisayo ithi: ukuguguleka okuncane → ukushisa kuqala → ukushisela okunamathelayo → i-spray tin → ukuhlanza.

Umoya oshisayo uyisicaba, owaziwa nangokuthi i-hot air welded (evame ukwaziwa ngokuthi i-tin spray), okuyinqubo yokumboza ithini elincibilikayo (umthofu) elishiselwe endaweni ye-PCB nokusebenzisa ukushisisa ukuze ucindezele ukulungiswa komoya (ukuvuthela) ukuze kwakheke. ungqimba lwe-anti-copper oxidation.Ingase futhi inikeze izendlalelo ezinhle zokugqoka zokushisela.I-weld yonke kanye nethusi lomoya oshisayo kwakha inhlanganisela yensimbi yethusi -tin ekuhlanganisweni.I-PCB ivame ukucwila emanzini ashiselwe ancibilikayo;ummese womoya uphephetha uketshezi oluyisicaba olushiselwe uketshezi olushiselwe ngaphambi kokushiselwe;

Izinga lomoya oshisayo lihlukaniswe izinhlobo ezimbili: mpo kanye ne-horizontal.Kukholelwa ukuthi uhlobo oluvundlile lungcono.Ikakhulukazi ungqimba oluvundlile lokulungiswa komoya oshisayo lufana ngokuqhathaniswa, olungafinyelela ukukhiqizwa okuzenzakalelayo.

Izinzuzo: isikhathi eside sokulondoloza;ngemva kokuqedwa kwe-PCB, ingaphezulu lethusi limanzi ngokuphelele (ithini limbozwe ngokuphelele ngaphambi kokushisela);kufanelekile ukushisela umthofu;inqubo evuthiwe, izindleko eziphansi, ezifanele ukuhlolwa okubonakalayo nokuhlolwa kukagesi

Ukungalungi: Ayilungele ukubopha ulayini;ngenxa yenkinga yokushibilika kwendawo, kukhona nemikhawulo ku-SMT;ayifaneleki idizayini yokushintsha othintana naye.Lapho ufutha ithini, ithusi lizoncibilika, futhi ibhodi lishisa kakhulu.Ikakhulukazi amapuleti awugqinsi noma amancanyana, isifutho sikathayela sinomkhawulo, futhi ukusebenza kokukhiqiza akulula.

• 2, isivikelo se-organic weldability (OSP)

Inqubo evamile iwukuthi: ukwehlisa amafutha -> ukucwiliswa okuncane -> ukuchotshozwa -> ukuhlanzwa kwamanzi ahlanzekile -> ukugqoka okuphilayo -> ukuhlanza, nokulawula inqubo kulula ukukhombisa inqubo yokwelapha.

I-OSP iyinqubo yokwelashwa kwe-copper foil surface ephrintiwe (PCB) ngokuhambisana nezidingo zomyalelo we-RoHS.I-OSP imfushane kokuthi i-Organic Solderability Preservatives, eyaziwa nangokuthi i-organic solderability preservatives, eyaziwa nangokuthi i-Preflux ngesiNgisi.Kalula nje, i-OSP iyifilimu yesikhumba ekhule ngamakhemikhali endaweni ehlanzekile, engenalutho yethusi.Le filimu ine-anti-oxidation, ukushaqeka kokushisa, ukumelana nomswakama, ukuvikela indawo yethusi endaweni evamile ayisekho ukugqwala (i-oxidation noma i-vulcanization, njll.);Kodwa-ke, ekushiseni okuphezulu okulandelayo kwe-welding, le filimu evikelayo kufanele isuswe kalula yi-flux ngokushesha, ukuze indawo yethusi ehlanzekile eveziwe ingahlanganiswa ngokushesha ne-solder encibilikisiwe ngesikhathi esifushane kakhulu ukuze ibe inhlanganisela ye-solder eqinile.

Izinzuzo: Inqubo ilula, ingaphezulu liyisicaba kakhulu, lilungele ukushisela okungenamthofu kanye ne-SMT.Kulula ukusetshenzwa kabusha, ukusebenza kokukhiqiza okulula, okulungele ukusebenza komugqa ovundlile.Ibhodi lifanele ukucutshungulwa okuningi (isb. OSP+ENIG).Izindleko eziphansi, azihambisani nemvelo.

Ukungalungi: umkhawulo wenombolo ye-reflow welding (i-welding eminingi, ifilimu izobhujiswa, ngokuyisisekelo izikhathi ezi-2 akukho nkinga).Ayifanele ubuchwepheshe be-crimp, intambo yokubopha.Ukutholwa okubonakalayo nokutholwa kukagesi akulula.Ukuvikelwa kwegesi ye-N2 kuyadingeka ku-SMT.Ukusebenza kabusha kwe-SMT akufanelekile.Izimfuneko zesitoreji esiphezulu.

• 3, ipuleti lonke ligcwele igolide le-nickel

I-Plate nickel plating iyi-PCB surface conductor kuqala ehlanganiswe ungqimba lwe-nickel yabe ihlanganiswe nongqimba lwegolide, i-nickel plating ihlose ukuvimbela ukuhlukaniswa phakathi kwegolide nethusi.Kunezinhlobo ezimbili zegolide le-nickel elenziwe nge-electroplated: igolide elithambile (igolide elihlanzekile, indawo yegolide ayibukeki igqamile) kanye ne-hard gold plating (indawo ebushelelezi neqinile, engagugi, equkethe ezinye izakhi ezifana ne-cobalt, indawo yegolide ibukeka igqamile).Igolide elithambile lisetshenziselwa ikakhulukazi ukupakisha ucingo lwegolide lwe-chip;Igolide eliqinile lisetshenziswa kakhulu ekuxhumaneni kukagesi okungewona amashidi.

Izinzuzo: Isikhathi eside sokulondoloza > izinyanga eziyi-12.Ifanele idizayini yokushintsha othintana naye kanye nokubopha intambo yegolide.Ifanele ukuhlolwa kukagesi

Ubuthakathaka: Izindleko eziphakeme, igolide eliwugqinsi.Iminwe ene-electroplated idinga ukuqhutshwa kocingo lokuklama okwengeziwe.Ngenxa yokuthi ubukhulu begolide abuhambisani, uma busetshenziswa ekushiseleni, kungase kubangele i-embrittlement ye-solder joint ngenxa yegolide eliningi kakhulu, elithinta amandla.Inkinga yokufana kwendawo ye-Electroplating.Igolide le-nickel elenziwe nge-electroplated alibambi unqenqema lwentambo.Ayifanele i-aluminium wire bonding.

• 4. Zika igolide

Inqubo evamile yile: ukuhlanza i-pickling -> i-micro-corrosion -> i-preleaching -> ukusebenza -> i-electroless nickel plating -> i-chemical gold leaching;Kunamathangi amakhemikhali ayi-6 kule nqubo, ahlanganisa cishe izinhlobo zamakhemikhali eziyi-100, futhi inqubo iyinkimbinkimbi kakhulu.

Igolide elizikayo ligoqwe ngengxube yegolide ye-nickel ewugqinsi, esebenza kahle kagesi endaweni yethusi, engavikela i-PCB isikhathi eside;Ngaphezu kwalokho, iphinde ibe nokubekezelelana kwemvelo ukuthi ezinye izinqubo zokwelashwa ezingaphezulu ezingenakho.Ngaphezu kwalokho, ukucwila kwegolide kungavimbela nokuhlakazwa kwethusi, okuzozuzisa umhlangano ongenamthofu.

Izinzuzo: akulula ukwenza i-oxidize, ingagcinwa isikhathi eside, ingaphezulu liyisicaba, lifanele ukushisela izikhonkwane ze-gap emihle kanye nezingxenye ezinamalunga amancane e-solder.Ibhodi le-PCB elikhethwayo elinezinkinobho (njengebhodi leselula).I-Reflow welding ingaphindaphindwa izikhathi eziningi ngaphandle kokulahlekelwa okuningi kokushisela.Ingasetshenziswa njengesisekelo sezintambo ze-COB (Chip On Board).

Ukungalungi: izindleko eziphezulu, amandla ampofu we-welding, ngoba ukusetshenziswa kwenqubo ye-nickel engeyona i-electroplated, kulula ukuba nezinkinga zediski emnyama.Ungqimba lwe-nickel luba ne-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside kuyinkinga.

• 5. Ithini elicwilayo

Njengoba wonke ama-solder amanje asekelwe ku-tin, ungqimba lwethini lungafaniswa nanoma yiluphi uhlobo lwe-solder.Inqubo yokucwila ithini ingenza inhlanganisela yensimbi ye-copper-tin eyisicaba, eyenza ithini elizikayo libe nokudaleka okuhle okufanayo nokulingana komoya oshisayo ngaphandle kwekhanda eliphansi lenkinga yokulingana komoya oshisayo;Ipuleti likathayela alikwazi ukugcinwa isikhathi eside kakhulu, futhi umhlangano kufanele wenziwe ngokohlelo lokucwiliswa kwethini.

Izinzuzo: Ifanele ukukhiqizwa komugqa ovundlile.Ifanele ukucutshungulwa komugqa ocolekile, ofanele ukushisela okungenamthofu, ikakhulukazi kubuchwepheshe be-crimping.Ukucaba okuhle kakhulu, kulungele i-SMT.

Ukungalungi: Kudingeka izimo ezinhle zokugcina, okungcono zingabi ngaphezu kwezinyanga eziyisi-6, ukulawula ukukhula kwentshebe.Ayilungele idizayini yokushintsha othintana naye.Enqubweni yokukhiqiza, inqubo yefilimu yokumelana ne-welding iphakeme kakhulu, ngaphandle kwalokho izobangela ukuba ifilimu yokumelana nokushisela iwele.Ngokushisela okuningi, ukuvikela igesi ye-N2 kungcono kakhulu.Ukulinganisa ngogesi nakho kuyinkinga.

• 6. Isiliva elicwilayo

Inqubo yokucwilisa isiliva iphakathi kwe-organic coating kanye ne-electroless nickel/plating yegolide, inqubo ilula futhi iyashesha;Ngisho nalapho ivezwa ukushisa, umswakama kanye nokungcola, isiliva lisakwazi ukugcina ukushisela okuhle, kodwa lizolahlekelwa ukucwebezela kwalo.I-Silver plating ayinawo amandla angokomzimba e-electroless nickel plating/igolide ngoba ayikho i-nickel ngaphansi kongqimba lwesiliva.

Izinzuzo: Inqubo elula, ilungele ukushisela okungenayo umthofu, i-SMT.Indawo eyisicaba kakhulu, izindleko eziphansi, ezifanele imigqa emihle kakhulu.

Ukungalungi: Izidingo eziphezulu zesitoreji, kulula ukungcolisa.Amandla okushisela ajwayele ukuba nezinkinga (inkinga ye-micro-cavity).Kulula ukuba ne-electromigration phenomenon kanye ne-Javani bite phenomenon yethusi ngaphansi kwefilimu yokumelana ne-welding.Ukulinganisa ngogesi nakho kuyinkinga

• 7, ikhemikhali ye-nickel palladium

Uma kuqhathaniswa nemvula yegolide, kunongqimba olwengeziwe lwe-palladium phakathi kwe-nickel negolide, futhi i-palladium inganqanda isenzakalo sokugqwala okubangelwa ukusabela kokubuyisela futhi yenze amalungiselelo agcwele emvula yegolide.Igolide limbozwe eduze ne-palladium, linikeza indawo enhle yokuxhumana.

Izinzuzo: Ifanele ukushisela ngaphandle komthofu.Indawo eyisicaba kakhulu, ilungele i-SMT.Ngezimbobo kungase futhi kube nickel igolide.Isikhathi eside sokulondoloza, izimo zokugcina azinzima.Ifanele ukuhlolwa kukagesi.Ifanele idizayini yokushintsha othintana naye.Ifanele i-aluminium yokubopha izintambo, ifanele ipuleti eliwugqinsi, ukumelana okuqinile nokuhlaselwa kwemvelo.

• 8. Electroplating igolide eliqinile

Ukuze uthuthukise ukumelana nokugqokwa komkhiqizo, khulisa inani lokufaka nokususwa kanye ne-electroplating yegolide eliqinile.

Izinguquko zenqubo yokwelashwa kwe-PCB ebusweni azinkulu kakhulu, kubonakala sengathi kuyinto ekude kakhulu, kodwa kufanele kuqashelwe ukuthi izinguquko ezihamba kancane zesikhathi eside zizoholela ezinguqukweni ezinkulu.Esimeni sokwanda kwezingcingo zokuvikelwa kwemvelo, inqubo yokwelashwa okungaphezulu kwe-PCB izoshintsha kakhulu ngokuzayo.