I-OEM PCBA Clone Assembly Service Enye i-PCB ne-PCBA Custom Electronics PCB Circuit Board

Incazelo emfushane:

Isicelo:I-Aerospace, BMS, Communication, Computer, Consumer Electronics, Into esebenza ekhaya, i-LED, Amathuluzi Ezokwelapha, Ibhodi Lomama, I-Smart electronics, Ukushaja okungenantambo

Isici:I-PCB esebenzayo, i-PCB yokuminyana okuphezulu

I-Insulation Material: I-Epoxy Resin, Izinto Ezihlanganisiwe Zensimbi, I-Organic Resin

Material: I-Aluminium Embozwe Nge-Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber

Ubuchwepheshe Bokucubungula: I-Delay Pressure Foil, i-Electrolytic Foil

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukucaciswa

PCB Amandla Obuchwepheshe

Izendlalelo Ukukhiqizwa kwenqwaba: 2~58 izendlalelo / Ukushayela komshayeli: izendlalelo ezingama-64

Ubukhulu. Ukuqina Ukukhiqizwa Okuningi: 394mil (10mm) / Ukushayela komshayeli: 17.5mm

Materials FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , I-Halogen-Free, i-Ceramic egcwele , Teflon, Polyimide, BT,PPO,PPE, Hybrid, Partial hybrid, njll.

Okuncane. Ububanzi/Isikhala Isendlalelo sangaphakathi: 3mil/3mil (HOZ), Isendlalelo sangaphandle: 4mil/4mil(1OZ)

Ubukhulu. Ukuqina Kwethusi 6.0 OZ / Ukugijima komshayeli: 12OZ

Okuncane. Usayizi Wembobo Ukubhoboza Komshini: 8mil(0.2mm) I-Laser drill: 3mil(0.075mm)

I-Surface Finish HASL,Igolide lokucwiliswa, ithini lokucwiliswa, i-OSP, i-ENIG + OSP, ukucwiliswa, i-ENEPIG, umunwe wegolide

Inqubo Ekhethekile Embelwe Imbobo, Imbobo Eyimpumputhe, Ukumelana Okushumekiwe, Umthamo Oshumekiwe, Ingxubevange, Ingxube Eyingxenye, Ukuminyana okuphezulu ngokwengxenye, Ukubhola Emuva, nokulawula Ukumelana

PCBA technical Capacity

Izinzuzo -----Professional Surface-mounting and Through-hole soldering technology

----Osayizi abahlukahlukene njengobuchwepheshe bezingxenye ze-SMT eziyi-1206,0805,0603

----ICT(In Circuit Test),FCT(Functional Circuit Test)

----PCB Assembly With UL,CE,FCC,Rohs Approval

----Ubuchwepheshe bokuthengisa kabusha kwegesi ye-nitrogen ye-SMT.

----High Standard SMT&Solder Assembly Line

----Umthamo wobuchwepheshe wokubekwa kwebhodi oxhumene nokuminyana okuphezulu.

Izingxenye ze-Passive Down to 0201 size, BGA ne-VFBGA, Leadless Chip Carriers/CSP

I-SMT Assembly enamacala amabili, i-Fine Pitch kuya ku-0.8mils, Ukulungiswa kwe-BGA kanye ne-Reball

Ukuhlola I-Flying Probe Test, Ukuhlolwa kwe-X-ray Ukuhlolwa kwe-AOI

Ukunemba kwesikhundla se-SMT	20 um
Usayizi wezingxenye	0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP
Ubukhulu. ukuphakama kwengxenye	25 mm
Ubukhulu. Usayizi we-PCB	680×500mm
Okuncane. Usayizi we-PCB	akukho okulinganiselwe
Ubukhulu be-PCB	0.3 kuya ku-6 mm
I-Wave-Solder Max. Ububanzi be-PCB	450mm
Okuncane. Ububanzi be-PCB	akukho okulinganiselwe
Ubude bengxenye	Phezulu 120mm/Bot 15mm
Uhlobo lwe-Sweat-Solder Metal	ingxenye, yonke, inlay, sidestep
Izinto zensimbi	Ithusi, i-Aluminium
I-Surface Qeda	Plating Au, , Plating Sn
Izinga lomoya esinyeni	ngaphansi kuka-20%
Cindezela-linganisa Ibanga lokucindezela	0-50KN
Ubukhulu. Usayizi we-PCB	800X600mm