I-One-stop Electronic Manufacturing Services, ikusiza ukuthi uzuze kalula imikhiqizo yakho ye-elekthronikhi evela ku-PCB ne-PCBA

Yini okufanele inake i-PCB enezingqimba eziningi?

Ubukhulu obuphelele nenani lezendlalelo zebhodi lezendlalelo eziningi ze-PCB kunqunyelwe izici zebhodi le-PCB. Amabhodi akhethekile anqunyelwe ukushuba kwebhodi okunganikezwa, ngakho umklami kufanele acabangele izici zebhodi zenqubo yokuklama ye-PCB kanye nemikhawulo yobuchwepheshe bokucubungula i-PCB.

Izinyathelo zokuqapha zenqubo yokuhlanganisa izendlalelo eziningi

I-Laminating iyinqubo yokuhlanganisa ungqimba ngalunye lwebhodi lesifunda libe lilonke. Yonke inqubo ihlanganisa ukucindezela kokuqabula, ukucindezela okugcwele kanye nokucindezela okubandayo. Ngesikhathi sesiteji sokucindezela ukuqabula, i-resin ingena endaweni ebophayo futhi igcwalise izikhala kulayini, bese ingena ngokucindezela okugcwele ukuze ibophe zonke izikhala. Okubizwa ngokuthi ukucindezela okubandayo ukupholisa ibhodi lesifunda ngokushesha futhi ugcine usayizi uzinzile.

Inqubo ye-laminating idinga ukunaka izindaba, okokuqala ekwakhiweni, kufanele ihlangabezane nezidingo zebhodi elingaphakathi elingaphakathi, ikakhulukazi ukushuba, usayizi womumo, imbobo yokubeka, njll., Idinga ukuklanywa ngokuhambisana nezidingo ezithile, i Izidingo zebhodi elingaphakathi jikelele alikho elivulekile, elifushane, elivulekile, alikho i-oxidation, alikho ifilimu eyinsalela.

Okwesibili, lapho u-laminating amabhodi we-multilayer, amabhodi angaphakathi angaphakathi adinga ukuphathwa. Inqubo yokwelapha ihlanganisa ukwelashwa kwe-black oxidation kanye nokwelashwa kwe-Browning. Ukwelashwa kwe-oxidation ukwenza ifilimu ye-oxide emnyama ecwecweni lethusi elingaphakathi, futhi ukwelashwa okunsundu kuwukwenza ifilimu ephilayo kucwecwe lwethusi lwangaphakathi.

Okokugcina, lapho i-laminating, sidinga ukunaka izindaba ezintathu: izinga lokushisa, ingcindezi kanye nesikhathi. Izinga lokushisa ngokuyinhloko libhekisela ekuncibilikeni kwezinga lokushisa kanye nezinga lokushisa le-resin, izinga lokushisa elimisiwe le-hot plate, izinga lokushisa langempela lezinto kanye nokushintsha kwezinga lokushisa. Le mingcele idinga ukunakwa. Ngokuqondene nokucindezela, umgomo oyisisekelo uwukugcwalisa umgodi we-interlayer nge-resin ukuze ukhiphe amagesi e-interlayer kanye nokuguquguquka. Imingcele yesikhathi ilawulwa ikakhulukazi isikhathi sokucindezela, isikhathi sokushisa nesikhathi sejeli.


Isikhathi sokuthumela: Feb-19-2024