Ukufakwa okunembe nokunembile kwezingxenye ezihlanganiswe phezulu endaweni egxilile ye-PCB kuyinjongo eyinhloko yokucubungula isichibi se-SMT. Kodwa-ke, ngesikhathi sokucubungula, kuzoba nezinkinga ezithile, ezizothinta ikhwalithi ye-patch, phakathi kwazo okuvame kakhulu inkinga yokufuduka kwengxenye.
Izimbangela ezihlukene zokushintsha ukupakisha ziyehluka ezimbangela ezivamile
(1) Isivinini somoya se-reflow welding welding sikhulu kakhulu (ikakhulukazi senzeka esithandweni se-BTU, izingxenye ezincane neziphakeme kulula ukuzishintsha).
(2) Ukudlidliza kukaloliwe wokuqondisa kagesi, kanye nesenzo sokudlulisa isikhweli (izingxenye ezisinda kakhulu)
(3) Idizayini yephedi i-asymmetrical.
(4) Ukuphakama kwephedi yosayizi omkhulu (SOT143).
(5) Izingxenye ezinamaphini ambalwa nezipani ezinkulu kulula ukudonselwa eceleni yi-solder surface tension. Ukubekezelela izingxenye ezinjalo, njengamakhadi e-SIM, amaphedi noma i-steel mesh I-Windows kufanele ibe ngaphansi kobubanzi bephinikhodi yengxenye kanye no-0.3mm.
(6) Ubukhulu bazo zombili iziphetho zezingxenye buhlukile.
(7) Amandla angalingani ezingxenyeni ezithile, njengephakeji lokududula okunqanda ukumanzisa, imbobo yokubeka noma i-slot card yokufaka.
(8) Eduze kwezingxenye ezijwayele ukukhipha umoya, njengama-tantalum capacitor.
(9) Ngokuvamile, i-solder paste enomsebenzi oqinile akulula ukuyishintsha.
(10) Noma iyiphi into engabangela ikhadi elimile lizodala ukugudluzwa.
Ngezizathu ezithile:
Ngenxa ye-reflow welding, ingxenye ibonisa isimo sokuntanta. Uma kudingeka ukuma okunembile, umsebenzi olandelayo kufanele wenziwe:
(1) Ukuphrinta kwe-solder paste kufanele kunembile futhi usayizi wewindi lemeshi lensimbi akufanele libe ngaphezu kuka-0.1mm ububanzi kunophini wengxenye.
(2) Dala ngokunengqondo iphedi nendawo yokufaka ukuze izingxenye zikwazi ukulinganisa ngokuzenzakalelayo.
(3) Lapho uklama, igebe phakathi kwezingxenye zesakhiwo kufanele likhuliswe ngendlela efanele.
Isikhathi sokuthumela: Mar-08-2024
