Ijubane lokuqanjwa kabusha kwemboni ye-PCB liyakhula ngesivinini: ubuchwepheshe obusha, izinto zokwakha ezintsha kanye nokukhiqizwa okuluhlaza kuhola intuthuko yesikhathi esizayo.

Esimweni segagasi ledijithali nobuhlakani obushanela umhlaba, imboni yebhodi lesifunda ephrintiwe (PCB), “njengenethiwekhi ye-neural” yamadivayisi kagesi, iphromotha ukuqamba okusha noshintsho ngesivinini esingakaze sibonwe. Muva nje, ukusetshenziswa kochungechunge lobuchwepheshe obusha, izinto ezintsha kanye nokuhlolwa okujulile kokukhiqizwa okuluhlaza kufake ubungqabavu obusha embonini ye-PCB, okubonisa ikusasa elisebenza kahle, elinobungani nemvelo nelihlakaniphile.

Okokuqala, ukusungulwa kwezobuchwepheshe kukhuthaza ukuthuthukiswa kwezimboni

Ngokuthuthuka okusheshayo kobuchwepheshe obusafufusa obufana ne-5G, ubuhlakani bokwenziwa, kanye ne-inthanethi Yezinto, izidingo zobuchwepheshe ze-PCB ziyakhula. Ubuchwepheshe bokukhiqiza be-PCB obuthuthukisiwe obufana ne-high density Interconnect (HDI) kanye ne-Any-Layer Interconnect (ALI) busetshenziswa kabanzi ukuze kuhlangatshezwane nezidingo ze-miniaturization, engasindi nokusebenza okuphezulu kwemikhiqizo kagesi. Phakathi kwabo, ubuchwepheshe bengxenye eshumekiwe bushumeke ngokuqondile izingxenye ze-elekthronikhi ngaphakathi kwe-PCB, kusindisa kakhulu isikhala nokuthuthukisa ukuhlanganiswa, sekube ubuchwepheshe obuyinhloko bokusekela imishini ye-elekthronikhi ephezulu.

Ngaphezu kwalokho, ukukhuphuka kwemakethe yezisetshenziswa eziguquguqukayo nezigqokekayo kuholele ekuthuthukisweni kwe-PCB eguquguqukayo (FPC) kanye ne-PCB eqinile eguquguqukayo. Ngokugoba kwayo okuyingqayizivele, ukukhanya nokumelana nokugoba, le mikhiqizo ihlangabezana nezidingo ezidingekayo zenkululeko ye-morphological nokuqina ezinhlelweni zokusebenza ezifana namawashi ahlakaniphile, amadivayisi we-AR/VR, nezifakelo zezokwelapha.

Okwesibili, izinto ezintsha zivula imingcele yokusebenza

Okubalulekile kuyisisekelo esibalulekile sokuthuthukiswa kokusebenza kwe-PCB. Eminyakeni yamuva nje, ukuthuthukiswa kanye nokusetshenziswa kwama-substrates amasha afana namapuleti agqoke i-copper-speed high-speed high-speed, i-dielectric constant (Dk) kanye ne-low loss factor (Df) izinto zenze i-PCB yakwazi kangcono ukusekela ukudluliswa kwesignali ngesivinini esikhulu. futhi uvumelane nezidingo zokucubungula idatha ze-high-frequency, isivinini esikhulu kanye nomthamo omkhulu wezokuxhumana kwe-5G, izikhungo zedatha nezinye izinkambu.

Ngesikhathi esifanayo, ukuze ubhekane nesimo esinzima sokusebenza, njengokushisa okuphezulu, umswakama ophezulu, ukugqwala, njll., izinto ezikhethekile ezifana ne-ceramic substrate, i-polyimide (PI) substrate nezinye izinto eziphakeme zokushisa kanye nokugqwala zaqala ukuvela, ukuhlinzeka ngesisekelo se-hardware esithembeke kakhulu se-aerospace, i-automotive electronics, i-automation yezimboni kanye neminye imikhakha.

Okwesithathu, izindlela zokukhiqiza eziluhlaza zenza intuthuko eqhubekayo

Namuhla, ngokuthuthuka okuqhubekayo kokuqwashisa ngemvelo emhlabeni wonke, imboni ye-PCB iwufeza ngenkuthalo umthwalo wayo wemfanelo womphakathi futhi ikhuthaza ngamandla ukwenziwa kwezinto eziluhlaza. Kusukela emthonjeni, ukusetshenziswa kwezinto ezingenamthofu, ezingenalo i-halogen nezinye izinto ezingavuthiwe ezithinta imvelo ukunciphisa ukusetshenziswa kwezinto eziyingozi; Enqubweni yokukhiqiza, thuthukisa ukugeleza kwenqubo, uthuthukise ukusebenza kahle kwamandla, unciphise ukukhishwa kwemfucuza; Ekupheleni komjikelezo wempilo yomkhiqizo, khuthaza ukugaywa kabusha kwe-PCB yemfucuza futhi wakhe uchungechunge lwezimboni oluvaliwe.

Muva nje, i-biodegradable PCB material eyakhiwe izikhungo zocwaningo lwesayensi namabhizinisi yenze impumelelo ebalulekile, engabola ngokwemvelo endaweni ethile ngemva kokulahlwa kwemfucumfucu, inciphise kakhulu umthelela wemfucuza ye-elekthronikhi endaweni ezungezile, futhi kulindeleke ukuthi ibe yisilinganiso esisha sokuluhlaza. PCB esikhathini esizayo.