Ebhodini lesekethe le-PCB kunenqubo ebizwa nge-PCB electroplating. I-PCB plating iyinqubo lapho kufakwa khona insimbi enamathela ebhodini le-PCB ukuze kuthuthukiswe ukusebenza kwayo kagesi, ukumelana nokugqwala kanye nekhono lokushisela.
Ukuhlolwa kwe-ductility kwe-PCB electroplating kuyindlela yokuhlola ukwethembeka nekhwalithi yokucwenga ebhodini le-PCB.
I-PCB electroplating
Inqubo yokuhlola i-Ductility
1.Lungiselela isampula yokuhlola:Khetha isampula ye-PCB emele futhi uqinisekise ukuthi indawo yayo ilungile futhi ayinakho ukungcola noma ukonakala.
2.Yenza ukuhlolwa:Yenza ukusika okuncane noma ukuklwebha kusampula ye-PCB ukuze kuhlolwe i-ductility.
3.Yenza ukuhlolwa kwe-tensile:Beka isampula ye-PCB kumishini yokuhlola efanele, njengomshini wokunweba noma umhloli wokuhlubula. Ukungezwani okwandayo kancane kancane noma amandla okukhumula asetshenziswa ukulingisa ingcindezi endaweni yokusetshenziswa kwangempela.
4.Imiphumela yokubuka neyokulinganisa:Qaphela noma yikuphi ukuphuka, ukuqhekeka noma ukuxebuka okwenzeka ngesikhathi sokuhlolwa. Kala amapharamitha ahlobene ne-ductility, njengobude bokwelula, amandla okuphuka, njll.
5.Imiphumela yokuhlaziya:Ngokwemiphumela yokuhlolwa, i-ductility ye-PCB coating iyahlolwa. Uma isampula limelana nokuhlolwa kwe-tensile futhi lihlala linjalo, libonisa ukuthi ukunamathela kune-ductility enhle.
Okungenhla ukuhlanganisa kwethu okuqukethwe okufanelekile kokuhlolwa kwe-pcb electroplating ductility test. Izindlela namazinga athile okuhlolwa kwe-PCB electroplating ductility kungahluka kuye ngezimboni ezihlukene kanye nezinhlelo zokusebenza.
Isikhathi sokuthumela: Nov-14-2023
