Ukushisa kokushisa kwebhodi lesifunda le-PCB kuyisixhumanisi esibaluleke kakhulu, ngakho-ke liyini ikhono lokukhipha ukushisa lebhodi lesifunda le-PCB, ake sixoxe ngakho ndawonye.
Ibhodi le-PCB elisetshenziselwa kakhulu ukuqeda ukushisa ngebhodi le-PCB ngokwalo liyi-substrate yendwangu yengilazi embozwe ngethusi/epoxy noma i-phenolic resin glass cloth substrate, futhi kunenani elincane leshidi elimbozwe ngethusi elisetshenziswe ephepheni. Nakuba lawa ma-substrates anezakhiwo ezinhle kakhulu zikagesi kanye nezakhiwo zokucubungula, anokushabalaliswa kahle kokushisa, futhi njengendlela yokukhipha ukushisa ezingxenyeni ezishisa kakhulu, akunakulindeleka ukuba aqhube ukushisa yi-PCB ngokwayo, kodwa ahlakaze ukushisa ebusweni be-PCB. ingxenye emoyeni ozungezile. Kodwa-ke, njengoba imikhiqizo ye-elekthronikhi ingene enkathini ye-miniaturization yengxenye, ukufakwa kwe-high-density, nomhlangano wokushisa okuphezulu, akwanele ukuthembela kuphela ebusweni bendawo encane kakhulu ukuze kukhishwe ukushisa. Ngesikhathi esifanayo, ngenxa yokusetshenziswa okukhulu kwezingxenye ezifakwe phezulu ezifana ne-QFP ne-BGA, ukushisa okukhiqizwa yizingxenye kudluliselwa ebhodini le-PCB ngobuningi, ngakho-ke, indlela engcono kakhulu yokuxazulula ukuchithwa kokushisa ukuthuthukisa amandla okukhipha ukushisa kwe-PCB ngokwayo ekuxhumaneni okuqondile nesici sokushisa, esisakazwa noma sisatshalaliswa ngebhodi le-PCB.
Isakhiwo se-PCB
a, idivayisi ezwela ukushisa ibekwe endaweni yomoya obandayo.
b, idivayisi yokuthola izinga lokushisa ibekwe endaweni eshisa kakhulu.
c, imishini ebhodini elifanayo eliphrintiwe kufanele ihlelwe ngokusemandleni akho ngokobukhulu bezinga layo lokushisa kanye nedigri yokushisa ukushisa, ukushisa okuncane noma amadivaysi angenamandla okumelana nokushisa (njengama-transistors amasignali amancane, amasekhethi amancane ahlanganisiwe, ama-electrolytic capacitor , njll.) abekwe endaweni ephezulu kakhulu yokugeleza komoya opholisayo (isango), Amadivayisi akhiqiza ukushisa okukhulu noma ukumelana nokushisa okuhle (njengama-transistors kagesi, amasekhethi amakhulu ahlanganisiwe, njll.) abekwe ezansi nomfula wokupholisa. ukusakaza.
d, endaweni evundlile, amadivaysi anamandla aphezulu ahlelwe eduze ngangokunokwenzeka emaphethelweni ebhodi eliphrintiwe ukuze anciphise indlela yokudlulisa ukushisa; Esiqondisweni esiqondile, amadivaysi anamandla aphezulu ahlelwa ngokuseduze ngangokunokwenzeka ebhodini eliphrintiwe, ukuze kuncishiswe umthelela wale mishini ekushiseni kwamanye amadivaysi lapho esebenza.
e, ukuchithwa kokushisa kwebhodi eliphrintiwe kumishini ikakhulukazi kuncike ekugelezeni komoya, ngakho-ke indlela yokugeleza komoya kufanele ifundwe ekwakhiweni, futhi idivayisi noma ibhodi lesifunda eliphrintiwe kufanele lilungiselelwe ngokunengqondo. Lapho umoya ugeleza, uvame ukugeleza lapho ukumelana kuphansi, ngakho-ke lapho ulungiselela idivayisi ebhodini lesifunda eliphrintiwe, kuyadingeka ukugwema ukushiya indawo enkulu yomoya endaweni ethile. Ukumiswa kwamabhodi esekethe aphrintiwe amaningi kuwo wonke umshini kufanele futhi kunake inkinga efanayo.
f, amadivaysi azwela kakhulu izinga lokushisa abekwe kangcono endaweni yezinga lokushisa eliphansi kakhulu (njengaphansi kwedivayisi), ungayibeki ngaphezu kwedivayisi yokushisisa, amadivaysi amaningi ayisakhiwo esihle kakhulu esintengantengi endizeni evundlile.
g, hlela idivayisi ngokusetshenziswa kwamandla okuphezulu kakhulu kanye nokukhipha ukushisa okukhulu kakhulu eduze nendawo engcono kakhulu yokukhipha ukushisa. Ungabeki izinto ezinokushisa okuphezulu emakhoneni nasemaphethelweni ebhodi eliphrintiwe, ngaphandle uma idivayisi yokupholisa ihlelwe eduze kwayo. Lapho uklama ukumelana kwamandla, khetha idivayisi enkulu ngangokunokwenzeka, futhi ulungise ukuhlelwa kwebhodi eliphrintiwe ukuze libe nesikhala esanele sokuqeda ukushisa.
Isikhathi sokuthumela: Mar-22-2024
