Inhloso eyisisekelo kakhulu yokwelashwa kwe-PCB ngaphezulu ukuqinisekisa ukushisela okuhle noma izakhiwo zikagesi. Ngenxa yokuthi ithusi ngokwemvelo livame ukuba khona ngesimo sama-oxides emoyeni, akunakwenzeka ukuthi ligcinwe njengethusi lokuqala isikhathi eside, ngakho-ke lidinga ukuphathwa ngethusi.
Kunezinqubo eziningi zokwelapha ezingaphezulu kwe-PCB. Izinto ezivamile ziyi-flat, i-organic welded protective agents (OSP), i-full -board nickel -plated gold, i-Shen Jin, i-Shenxi, i-Shenyin, i-nickel yamakhemikhali, igolide, ne-electroplating yegolide eliqinile. Uphawu.
1. Umoya oshisayo uyisicaba (spray tin)
Inqubo evamile yenqubo yokulinganisa komoya oshisayo ithi: ukuguguleka okuncane → ukushisa kuqala → ukushisela okunamathelayo → i-spray tin → ukuhlanza.
Umoya oshisayo uyisicaba, owaziwa nangokuthi i-hot air welded (evame ukwaziwa ngokuthi i-tin spray), okuyinqubo yokumboza ithini elincibilikayo (umthofu) elishiselwe endaweni ye-PCB nokusebenzisa ukushisisa ukuze ucindezele ukulungiswa komoya (ukuvuthela) ukuze kwakheke. ungqimba lwe-anti-copper oxidation. Ingase futhi inikeze izendlalelo ezinhle zokugqoka zokushisela. I-weld yonke kanye nethusi lomoya oshisayo kwakha inhlanganisela yensimbi yethusi -tin ekuhlanganisweni. I-PCB ivame ukucwila emanzini ashiselwe ancibilikayo; ummese womoya uphephetha uketshezi oluyisicaba olushiselwe uketshezi olushiselwe ngaphambi kokushiselwe;
Izinga lomoya oshisayo lihlukaniswe izinhlobo ezimbili: mpo kanye ne-horizontal. Kukholelwa ukuthi uhlobo oluvundlile lungcono. Ikakhulukazi ungqimba oluvundlile lokulungiswa komoya oshisayo lufana ngokuqhathaniswa, olungafinyelela ukukhiqizwa okuzenzakalelayo.
Izinzuzo: isikhathi eside sokulondoloza; ngemva kokuqedwa kwe-PCB, ingaphezulu lethusi limanzi ngokuphelele (ithini limbozwe ngokuphelele ngaphambi kokushisela); ilungele ukushisela umthofu; inqubo evuthiwe, izindleko eziphansi, ezifanele ukuhlolwa okubonakalayo nokuhlolwa kukagesi
Ukungalungi: Ayilungele ukubopha ulayini; ngenxa yenkinga yokushibilika kwendawo, kukhona nemikhawulo ku-SMT; ayifaneleki idizayini yokushintsha othintana naye. Lapho ufutha ithini, ithusi lizoncibilika, futhi ibhodi lishisa kakhulu. Ikakhulukazi amapuleti awugqinsi noma amancanyana, isifutho sikathayela sinomkhawulo, futhi ukusebenza kokukhiqiza akulula.
2, isivikelo se-organic weldability (OSP)
Inqubo evamile iwukuthi: ukususa amafutha -> i-micro-etching -> pickling -> ukuhlanza amanzi ahlanzekile -> ukugqoka okuphilayo -> ukuhlanza, nokulawula inqubo kulula ukukhombisa inqubo yokwelapha.
I-OSP iyinqubo yokwelashwa kwe-copper foil surface ephrintiwe (PCB) ngokuhambisana nezidingo zomyalelo we-RoHS. I-OSP imfushane kokuthi i-Organic Solderability Preservatives, eyaziwa nangokuthi i-organic solderability preservatives, eyaziwa nangokuthi i-Preflux ngesiNgisi. Kalula nje, i-OSP iyifilimu yesikhumba ekhule ngamakhemikhali endaweni ehlanzekile, engenalutho yethusi. Le filimu ine-anti-oxidation, ukushaqeka kokushisa, ukumelana nomswakama, ukuvikela indawo yethusi endaweni evamile ayisekho ukugqwala (i-oxidation noma i-vulcanization, njll.); Kodwa-ke, ekushiseni okuphezulu okulandelayo kwe-welding, le filimu evikelayo kufanele isuswe kalula yi-flux ngokushesha, ukuze indawo yethusi ehlanzekile eveziwe ingahlanganiswa ngokushesha ne-solder encibilikisiwe ngesikhathi esifushane kakhulu ukuze ibe inhlanganisela ye-solder eqinile.
Izinzuzo: Inqubo ilula, ingaphezulu liyisicaba kakhulu, lilungele ukushisela okungenamthofu kanye ne-SMT. Kulula ukusetshenzwa kabusha, ukusebenza kokukhiqiza okulula, okulungele ukusebenza komugqa ovundlile. Ibhodi lifanele ukucutshungulwa okuningi (isb. OSP+ENIG). Izindleko eziphansi, azihambisani nemvelo.
Ukungalungi: umkhawulo wenombolo ye-reflow welding (i-welding eminingi, ifilimu izobhujiswa, ngokuyisisekelo izikhathi ezi-2 akukho nkinga). Ayifanele ubuchwepheshe be-crimp, intambo yokubopha. Ukutholwa okubonakalayo nokutholwa kukagesi akulula. Ukuvikelwa kwegesi ye-N2 kuyadingeka ku-SMT. Ukusebenza kabusha kwe-SMT akufanelekile. Izimfuneko zesitoreji esiphezulu.
3, ipuleti lonke ligcwele igolide le-nickel
I-Plate nickel plating iyi-PCB surface conductor kuqala ehlanganiswe ungqimba lwe-nickel yabe ihlanganiswe nongqimba lwegolide, i-nickel plating ihlose ukuvimbela ukuhlukaniswa phakathi kwegolide nethusi. Kunezinhlobo ezimbili zegolide le-nickel elenziwe nge-electroplated: igolide elithambile (igolide elihlanzekile, indawo yegolide ayibukeki igqamile) kanye ne-hard gold plating (indawo ebushelelezi neqinile, engagugi, equkethe ezinye izakhi ezifana ne-cobalt, indawo yegolide ibukeka igqamile). Igolide elithambile lisetshenziselwa ikakhulukazi ukupakisha ucingo lwegolide lwe-chip; Igolide eliqinile lisetshenziswa kakhulu ekuxhumaneni kukagesi okungewona amashidi.
Izinzuzo: Isikhathi eside sokulondoloza > izinyanga eziyi-12. Ifanele idizayini yokushintsha othintana naye kanye nokubopha intambo yegolide. Ifanele ukuhlolwa kukagesi
Ubuthakathaka: Izindleko eziphakeme, igolide elikhudlwana. Iminwe ene-electroplated idinga ukuqhutshwa kocingo lokuklama okwengeziwe. Ngenxa yokuthi ubukhulu begolide abuhambisani, uma busetshenziswa ekushiseleni, kungase kubangele i-embrittlement ye-solder joint ngenxa yegolide eliningi kakhulu, elithinta amandla. Inkinga yokufana kwendawo ye-Electroplating. Igolide le-nickel elenziwe nge-electroplated alibambi unqenqema lwentambo. Ayifanele i-aluminium wire bonding.
4. Zika igolide
Inqubo evamile yile: ukuhlanzwa kwe-pickling -> micro-corrosion -> preleaching -> activation -> electroless nickel plating -> chemical leaching gold; Kunamathangi amakhemikhali ayi-6 kule nqubo, ahlanganisa cishe izinhlobo zamakhemikhali eziyi-100, futhi inqubo iyinkimbinkimbi kakhulu.
Igolide elizikayo ligoqwe ngengxube yegolide ye-nickel ewugqinsi, esebenza kahle kagesi endaweni yethusi, engavikela i-PCB isikhathi eside; Ngaphezu kwalokho, iphinde ibe nokubekezelelana kwemvelo ukuthi ezinye izinqubo zokwelashwa ezingaphezulu ezingenakho. Ngaphezu kwalokho, ukucwila kwegolide kungavimbela nokuhlakazwa kwethusi, okuzozuzisa umhlangano ongenamthofu.
Izinzuzo: akulula ukwenza i-oxidize, ingagcinwa isikhathi eside, ingaphezulu liyisicaba, lifanele ukushisela izikhonkwane ze-gap emihle kanye nezingxenye ezinamalunga amancane e-solder. Ibhodi le-PCB elikhethwayo elinezinkinobho (njengebhodi leselula). I-Reflow welding ingaphindaphindwa izikhathi eziningi ngaphandle kokulahlekelwa okuningi kokushisela. Ingasetshenziswa njengesisekelo sezintambo ze-COB (Chip On Board).
Ukungalungi: izindleko eziphezulu, amandla ampofu we-welding, ngoba ukusetshenziswa kwenqubo ye-nickel engeyona i-electroplated, kulula ukuba nezinkinga zediski emnyama. Ungqimba lwe-nickel luba ne-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside kuyinkinga.
5. Ithini elicwilayo
Njengoba wonke ama-solder amanje asekelwe ku-tin, ungqimba lwe-tin lungafaniswa nanoma yiluphi uhlobo lwe-solder. Inqubo yokucwila ithini ingenza inhlanganisela yensimbi ye-copper-tin eyisicaba, eyenza ithini elizikayo libe nokudaleka okuhle okufanayo nokulingana komoya oshisayo ngaphandle kwekhanda eliphansi lenkinga yokulingana komoya oshisayo; Ipuleti likathayela alikwazi ukugcinwa isikhathi eside kakhulu, futhi umhlangano kufanele wenziwe ngokohlelo lokucwiliswa kwethini.
Izinzuzo: Ifanele ukukhiqizwa komugqa ovundlile. Ifanele ukucutshungulwa komugqa ocolekile, ofanele ukushisela okungenamthofu, ikakhulukazi kubuchwepheshe be-crimping. Ukucaba okuhle kakhulu, kulungele i-SMT.
Ukungalungi: Kudingeka izimo ezinhle zokugcina, okungcono zingabi ngaphezu kwezinyanga eziyisi-6, ukulawula ukukhula kwentshebe. Ayilungele idizayini yokushintsha othintana naye. Enqubweni yokukhiqiza, inqubo yefilimu yokumelana ne-welding iphakeme kakhulu, ngaphandle kwalokho izobangela ukuba ifilimu yokumelana nokushisela iwele. Ngokushisela okuningi, ukuvikela igesi ye-N2 kungcono kakhulu. Ukulinganisa ngogesi nakho kuyinkinga.
6. Isiliva elicwilayo
Inqubo yokucwilisa isiliva iphakathi kwe-organic coating kanye ne-electroless nickel/plating yegolide, inqubo ilula futhi iyashesha; Ngisho nalapho ivezwa ukushisa, umswakama kanye nokungcola, isiliva lisakwazi ukugcina ukushisela okuhle, kodwa lizolahlekelwa ukucwebezela kwalo. I-Silver plating ayinawo amandla angokomzimba e-electroless nickel plating/igolide ngoba ayikho i-nickel ngaphansi kongqimba lwesiliva.
Izinzuzo: Inqubo elula, ilungele ukushisela okungenayo umthofu, i-SMT. Indawo eyisicaba kakhulu, izindleko eziphansi, ezifanele imigqa emihle kakhulu.
Ukungalungi: Izidingo eziphezulu zesitoreji, kulula ukungcolisa. Amandla okushisela ajwayele ukuba nezinkinga (inkinga ye-micro-cavity). Kulula ukuba ne-electromigration phenomenon kanye ne-Javani bite phenomenon yethusi ngaphansi kwefilimu yokumelana ne-welding. Ukulinganisa ngogesi nakho kuyinkinga
7, ikhemikhali ye-nickel palladium
Uma kuqhathaniswa nemvula yegolide, kunongqimba olwengeziwe lwe-palladium phakathi kwe-nickel negolide, futhi i-palladium inganqanda isenzakalo sokugqwala okubangelwa ukusabela kokubuyisela futhi yenze amalungiselelo agcwele emvula yegolide. Igolide limbozwe eduze ne-palladium, linikeza indawo enhle yokuxhumana.
Izinzuzo: Ifanele ukushisela ngaphandle komthofu. Indawo eyisicaba kakhulu, ilungele i-SMT. Ngezimbobo kungase futhi kube nickel igolide. Isikhathi eside sokulondoloza, izimo zokugcina azinzima. Ifanele ukuhlolwa kukagesi. Ifanele idizayini yokushintsha othintana naye. Ifanele i-aluminium yokubopha izintambo, ifanele ipuleti eliwugqinsi, ukumelana okuqinile nokuhlaselwa kwemvelo.
8. Electroplating igolide eliqinile
Ukuze uthuthukise ukumelana nokugqokwa komkhiqizo, khulisa inani lokufaka nokususwa kanye ne-electroplating yegolide eliqinile.
Izinguquko zenqubo yokwelashwa kwe-PCB ebusweni azinkulu kakhulu, kubonakala sengathi kuyinto ekude kakhulu, kodwa kufanele kuqashelwe ukuthi izinguquko ezihamba kancane zesikhathi eside zizoholela ezinguqukweni ezinkulu. Esimeni sokwanda kwezingcingo zokuvikelwa kwemvelo, inqubo yokwelashwa okungaphezulu kwe-PCB izoshintsha kakhulu ngokuzayo.
Isikhathi sokuthumela: Jul-05-2023
