Kusukela emlandweni wokuthuthukiswa kwe-chip, isiqondiso sokuthuthukiswa kwe-chip isivinini esikhulu, imvamisa ephezulu, ukusetshenziswa kwamandla okuphansi. Inqubo yokukhiqiza i-chip ikakhulukazi ihlanganisa ukuklama kwe-chip, ukukhiqizwa kwama-chip, ukukhiqizwa kokupakisha, ukuhlolwa kwezindleko nezinye izixhumanisi, phakathi kwazo inqubo yokukhiqiza ama-chip iyinkimbinkimbi kakhulu. Ake sibheke inqubo yokukhiqiza ama-chip, ikakhulukazi inqubo yokukhiqiza ama-chip.
Owokuqala ukwakhiwa kwe-chip, ngokuya ngezidingo zokuklama, "iphethini" ekhiqiziwe.
1, impahla eluhlaza ye-wafer ye-chip
Ukwakheka kwe-wafer kuyi-silicon, i-silicon icwengisiswa yisihlabathi se-quartz, i-wafer iyingxenye ye-silicon iyahlanzwa (99.999%), bese i-silicon ehlanzekile yenziwe ibe yinduku ye-silicon, eba yinto ye-quartz semiconductor yokwenza isekethe ehlanganisiwe. , ucezu luyisidingo esikhethekile sewafa yokukhiqiza i-chip. Uma i-wafer iba mncane, izindleko zokukhiqiza ziba zincane, kodwa ziba phezulu izidingo zenqubo.
2, I-wafer enamathela
I-wafer enamathela ingamelana ne-oxidation kanye nezinga lokushisa, futhi impahla iwuhlobo lwe-photoresistance.
3, ukuthuthukiswa kwe-wafer lithography, ukucwiliswa
Le nqubo isebenzisa amakhemikhali azwela ukukhanya kwe-UV, okuwenza athambe. Ukuma kwe-chip kungatholakala ngokulawula isikhundla se-shading. Ama-wafer e-silicon ahlanganiswe ne-photoresist ukuze ancibilike ekukhanyeni kwe-ultraviolet. Yilapho i-shading yokuqala ingasetshenziswa khona, ukuze ingxenye yokukhanya kwe-UV ihlakazwe, okungase kugezwe nge-solvent. Ngakho-ke konke okunye kufana nesimo somthunzi, okuyilokho esikufunayo. Lokhu kusinika ungqimba lwe-silica esiludingayo.
4,Engeza ukungcola
Ama-ion afakwa ku-wafer ukuze kukhiqizwe ama-semiconductors e-P kanye no-N ahambisanayo.
Inqubo iqala ngendawo eveziwe ku-silicon wafer bese ifakwa engxubeni yama-ion amakhemikhali. Inqubo izoshintsha indlela i-dopant zone ewuqhuba ngayo ugesi, ivumele i-transistor ngayinye ukuthi ivule, ivale noma iphathe idatha. Ama-chips alula angasebenzisa isendlalelo esisodwa kuphela, kodwa ama-chips ayinkimbinkimbi ngokuvamile anezingqimba eziningi, futhi inqubo iphindaphindiwe kaninginingi, ngezingqimba ezihlukene ezixhunywe ngefasitela elivuliwe. Lokhu kufana nomgomo wokukhiqiza webhodi le-PCB lesendlalelo. Ama-chips ayinkimbinkimbi kakhulu angase adinge izendlalelo eziningi ze-silica, ezingafinyelelwa ngokusebenzisa i-lithography ephindaphindiwe kanye nenqubo engenhla, ukwakha isakhiwo se-three-dimensional.
5, Ukuhlolwa kwe-wafer
Ngemva kwezinqubo ezimbalwa ezingenhla, i-wafer yakha i-lattice yezinhlamvu. Izici zikagesi zohlamvu ngalunye zihlolwe ngendlela 'yokulinganisa inaliti'. Ngokuvamile, inani lezinhlamvu ze-chip ngayinye likhulu, futhi kuyinqubo eyinkimbinkimbi kakhulu ukuhlela imodi yokuhlola iphinikhodi, edinga ukukhiqizwa okukhulu kwamamodeli anezicaciso ze-chip ezifanayo ngangokunokwenzeka ngesikhathi sokukhiqiza. Uma ivolumu iphezulu, izindleko ezilinganiselwe ziyancipha, okungesinye sezizathu ezenza ama-chip ajwayelekile ashibhe kangaka.
6, I-encapsulation
Ngemuva kokwakhiwa kwe-wafer, iphinikhodi iyalungiswa, futhi amafomu ahlukahlukene okupakisha akhiqizwa ngokuvumelana nezidingo. Lesi yisizathu sokuthi kungani i-chip core efanayo ingaba namafomu ahlukene okupakisha. Isibonelo: I-DIP, i-QFP, i-PLCC, i-QFN, njll. Lokhu kunqunywa kakhulu imikhuba yohlelo lwabasebenzisi, indawo yohlelo lokusebenza, ifomu lemakethe nezinye izici ezizungezile.
7. Ukuhlola nokupakishwa
Ngemuva kwenqubo engenhla, ukukhiqizwa kwama-chip sekuqediwe, lesi sinyathelo esokuhlola i-chip, ukususa imikhiqizo enesici, nokupakishwa.
Okungenhla okuqukethwe okuhlobene kwenqubo yokukhiqiza ama-chip ehlelwe yi-Create Core Detection. Ngethemba ukuthi izokusiza. Inkampani yethu inonjiniyela abangochwepheshe kanye nethimba le-elite embonini, inama-laboratories ajwayelekile ama-3, indawo yaselabhorethri ingaphezu kwamamitha-skwele ayi-1800, ingenza ukuqinisekiswa kokuhlolwa kwezingxenye ze-elekthronikhi, ukuhlonza iqiniso noma okungamanga kwe-IC, ukukhetha impahla yokuklama umkhiqizo, ukuhlaziya ukwehluleka, ukuhlolwa komsebenzi, ukuhlolwa kwezinto ezingenayo zasembonini kanye netheyiphu namanye amaphrojekthi okuhlola.
Isikhathi sokuthumela: Jul-08-2023
