Izinhlobo eziningi zezinto zokusetshenziswa zokukhiqiza zisetshenziswa ekucubunguleni isichibi se-SMT. I-tinnote iyona ebaluleke kakhulu. Ikhwalithi yokunamathisela ithini izothinta ngqo ikhwalithi yokushisela yokucubungula isichibi se-SMT. Khetha izinhlobo ezahlukene zama-tinnuts. Ake ngethule kafushane ukuhlukaniswa okujwayelekile kwe-tin paste:
I-Weld paste iwuhlobo lwe-pulp yokuxuba impushana yokushisela ne-agent yokushisela efana ne-paste (i-rosin, i-diluent, stabilizer, njll.) ngomsebenzi oshiselwe. Ngokwesisindo, ama-80 ~ 90% angama-alloys ensimbi. Ngokwevolumu, insimbi ne-solder kubalwe ku-50%.
Umfanekiso 3 Ama-granules ayishumi (SEM) (kwesokunxele)
Umfanekiso 4 Umdwebo othize wekhava ye-tin powder (kwesokudla)
I-solder paste ithwala izinhlayiya ze-tin powder. Ihlinzeka ngokuwohloka kokugeleza okufanele kakhulu kanye nomswakama ukuze kuthuthukiswe ukudluliswa kokushisa endaweni ye-SMT futhi kunciphise ukushuba kwesimo samanzi ku-weld. Izithako ezahlukene zibonisa imisebenzi ehlukene:
① Ukuncibilika:
I-solvent yalesi sithako se-weld ye-ingredient inokulungiswa okufanayo kokulungiswa okuzenzakalelayo kwinqubo yokusebenza ye-tin paste, enomthelela omkhulu empilweni ye-weld paste.
② I-resin:
Idlala indima ebalulekile ekwandiseni ukunamathela kokunamathisela ithini kanye nokulungisa nokuvimbela i-PCB ekufakweni kabusha kwe-oxidation ngemva kokushisela. Lesi sithako esiyisisekelo sinendima ebalulekile ekulungiseni izingxenye.
③ I-activant:
Idlala indima yokukhipha izinto ezine-oxidized ze-PCB yethusi ungqimba lwangaphezulu lwefilimu kanye nengxenye yesayithi lesichibi se-SMT, futhi inomphumela wokunciphisa ukungezwani okungaphezulu kwethayela noketshezi lomthofu.
④ Itende:
Ukulungiswa okuzenzakalelayo kwe-viscosity ye-weld paste kudlala indima ebalulekile ekunyatheliseni ukuvimbela umsila nokunamathela.
Okokuqala, ngokusho kokwakheka kokuhlukaniswa kwe-solder paste
I-1, i-lead solder paste: iqukethe izingxenye zomthofu, ukulimala okukhulu emvelweni nasemzimbeni womuntu, kepha umphumela wokushisela muhle, futhi izindleko ziphansi, zingasetshenziswa kweminye imikhiqizo ye-elekthronikhi ngaphandle kwezidingo zokuvikela imvelo.
2, unamathisele we-solder ongenamthofu: izithako ezihambisana nemvelo, ukulimala okuncane, ezisetshenziswa emikhiqizweni ye-elekthronikhi enobungani bemvelo, ngokuthuthukiswa kwezidingo zemvelo kazwelonke, ubuchwepheshe obungenamthofu embonini yokucubungula i-smt buzoba umkhuba.
Okwesibili, ngokusho kwephuzu lokuncibilika lokuhlukaniswa kwe-solder paste
Ngokuvamile, indawo yokuncibilika ye-solder paste ingahlukaniswa ngokushisa okuphezulu, izinga lokushisa eliphakathi nendawo kanye nezinga lokushisa eliphansi.
Izinga lokushisa eliphakeme elivame ukusetshenziswa yi-Sn-Ag-Cu 305,0307; I-Sn-Bi-Ag itholwe ezingeni lokushisa eliphakathi nendawo. I-Sn-Bi ivame ukusetshenziswa emazingeni okushisa aphansi. Ekucubunguleni isichibi se-SMT kudingeka kukhethwe ngokuya nezici zomkhiqizo ezihlukene.
Okwesithathu, ngokusho kokuqina kwe-tin powder division
Ngokusho kobubanzi bezinhlayiya ze-tin powder, i-tin paste ingahlukaniswa ibe yi-1, 2, 3, 4, 5, 6 amamaki empushana, okuthi 3, 4, 5 impushana isetshenziswe kakhulu. Umkhiqizo oyinkimbinkimbi kakhulu, ukukhethwa kwempushana kathini kudingeka kube kuncane, kodwa uma impushana encane, indawo ye-oxidation ehambisanayo ye-powder powder izokwanda, futhi i-tin powder eyindilinga isiza ukuthuthukisa izinga lokuphrinta.
No. 3 powder: Intengo ishibhile, ivame ukusetshenziswa ezinqubweni ezinkulu ze-smt;
Inombolo ye-4 powder: evame ukusetshenziswa ku-tight foot IC, i-smt chip processing;
No. 5 powder: Ivamise ukusetshenziswa ezingxenyeni zokushisela ezinembe kakhulu, omakhalekhukhwini, amaphilisi neminye imikhiqizo edinga kakhulu; Uma unzima kakhulu umkhiqizo wokucubungula i-smt patch, kubaluleke kakhulu ukukhetha okunamathiselwe kwe-solder, futhi ukukhethwa kokunamathisela kwe-solder okufanelekile komkhiqizo kusiza ukuthuthukisa inqubo yokucubungula i-smt patch.
Isikhathi sokuthumela: Jul-05-2023
