Uma sixoxa ngobuhlalu be-solder, sidinga kuqala ukuchaza ngokunembile isici se-SMT. Ubuhlalu bukathini butholakala epuleti elishiselwe ukugeleza kabusha, futhi ungasho shazi ukuthi iyibhola likathayela elikhulu elishumekwe echibini le-flux elibekwe eduze kwezingxenye ezihlukene ezinobude obuphansi kakhulu bomhlaba, njengama-resistors weshidi nama-capacitor, amaphakheji amancane wephrofayili amancane (TSOP), ama-transistors amaphrofayili amancane (SOT), ama-D-PAK transistors, nokumelana njengama-transistors. Ngenxa yesikhundla sabo maqondana nalezi zingxenye, ubuhlalu bethayela buvame ukubizwa ngokuthi "amasathelayithi".
Ubuhlalu be-tin abuthinti kuphela ukubonakala komkhiqizo, kodwa okubaluleke nakakhulu, ngenxa yobuningi bezingxenye epuleti eliphrintiwe, kunengozi yesifunda esifushane somugqa ngesikhathi sokusetshenziswa, ngaleyo ndlela kuthinte izinga lemikhiqizo ye-elekthronikhi. Kunezizathu eziningi zokukhiqiza ubuhlalu bethayela, ngokuvamile obubangelwa isici esisodwa noma ngaphezulu, ngakho-ke kufanele senze umsebenzi omuhle wokuvimbela nokwenza ngcono ukuze sikulawule kangcono. Isihloko esilandelayo sizodingida izici ezithinta ukukhiqizwa kobuhlalu bethayela kanye nezindlela zokunciphisa ukukhiqizwa kobuhlalu bethini.
Kungani kwenzeka ubuhlalu be-tin?
Kalula nje, ubuhlalu bukathini buvame ukuhlotshaniswa nokubekwa kwe-solder unamathisele kakhulu, ngenxa yokuthi ayinawo "umzimba" futhi icindezelwa ngaphansi kwezingxenye ezihlukene ukuze kwakhiwe ubuhlalu be-tin, futhi ukwanda kokubukeka kwabo kungabangelwa ukwanda kokusetshenziswa kwe-solder paste. Uma i-elementi ye-chip ifakwe ku-solder paste ekwazi ukuhlanzwa, unamathisele we-solder cishe uzokhama ngaphansi kwengxenye. Lapho idiphozithi solder unama kakhulu, kulula extrusion.
Izici eziyinhloko ezithinta ukukhiqizwa kobuhlalu bethini yilezi:
(1) Ukuvuleka kwesifanekiso kanye nomklamo wesithombe sephedi
(2) Ukuhlanza isifanekiso
(3) Ukunemba kokuphindaphinda komshini
(4) Ijika lezinga lokushisa lesithando somlilo sokugeleza kabusha
(5) Umfutho we-patch
(6) inani lokunamathisela nge-solder ngaphandle kwepani
(7) Ukuphakama kokuhlala kwethini
(8) Ukukhishwa kwegesi kwezinto eziguquguqukayo ku-line plate kanye nongqimba lokumelana ne-solder
(9)Kuhlobene nokuguquguquka
Izindlela zokuvimbela ukukhiqizwa kwamathini ubuhlalu:
(1) Khetha ihluzo zephedi ezifanele kanye nomklamo wosayizi. Ekwakhiweni kwephedi langempela, kufanele kuhlanganiswe ne-PC, bese ngokusho kosayizi wephakheji wengxenye yangempela, usayizi wokugcina we-welding, ukuklama usayizi wephedi ohambelanayo.
(2) Naka ukukhiqizwa kwensimbi yensimbi. Kuyadingeka ukulungisa usayizi wokuvula ngokusho kwesakhiwo sengxenye ethile yebhodi le-PCBA ukuze ulawule inani lokuphrinta lokunamathisela kwe-solder.
(3) Kunconywa ukuthi amabhodi e-PCB angenalutho ane-BGA, QFN kanye nezingxenye zezinyawo eziminyene ebhodini athathe isinyathelo esiqinile sokubhaka. Ukuqinisekisa ukuthi umswakama ongaphezulu ku-solder plate uyasuswa ukuze kwandiswe ukushisela.
(4) Thuthukisa izinga lokuhlanza izifanekiso. Uma ukuhlanza kungahlanzekile. Insalela yokunamathisela nge-solder ngaphansi kokuvuleka kwesifanekiso izonqwabelana eduze nendawo evulekile yesifanekiso futhi yakhe ukunamathisela kwe-solder kakhulu, kubangele ubuhlalu bethayela.
(5) Ukuqinisekisa ukuphindaphinda kwemishini. Lapho i-solder paste iphrintiwe, ngenxa ye-offset phakathi kwesifanekiso kanye nephedi, uma i-offset inkulu kakhulu, i-solder paste izocwiliswa ngaphandle kwephedi, futhi ubuhlalu be-tin buzovela kalula ngemva kokushisa.
(6) Lawula ingcindezi ekhuphukayo yomshini owufakayo. Ukuthi imodi yokulawula ingcindezi inamathiselwe, noma isilawuli ukujiya kwengxenye, Izilungiselelo zidinga ukulungiswa ukuze kuvinjelwe ubuhlalu bethayela.
(7)Lungiselela ijika lokushisa. Lawula izinga lokushisa lokugeleza kwe-welding, ukuze i-solvent ikwazi ukuguquguquka endaweni engcono kakhulu.
Ungabheki "isathelayithi" incane, umuntu akakwazi ukudonswa, donsa umzimba wonke. Ngama-electronics, udeveli uvame ukuba nemininingwane. Ngakho-ke, ngaphezu kokunaka kwabasebenzi abakhiqiza inqubo, iminyango efanele kufanele ibambisane, futhi ixhumane nabasebenzi benqubo kusenesikhathi ukuze kushintshwe izinto ezibonakalayo, ukushintshwa kanye nezinye izindaba ukuvimbela izinguquko kumingcele yenqubo ebangelwa izinguquko ezibonakalayo. Umklami obhekele ukwakhiwa kwesekethe ye-PCB kufanele futhi axhumane nabasebenzi benqubo, abhekisele ezinkingeni noma iziphakamiso ezihlinzekwa ngabasebenzi benqubo futhi azithuthukise ngangokunokwenzeka.
Isikhathi sokuthumela: Jan-09-2024
