| Ibanga Lekhwalithi | •I-IPC ejwayelekile 2-3 |
| Ubuchwepheshe bomhlangano | • Ama-SMD Stencil •PCB Fabrication • I-SMT PCB Assembly • I-THTumhlangano • Ukuhlangana Kwekhebula Nocingo • NgokuhlelekileUkugqoka • Imihlangano Yesixhumi Esibonakalayo • Ukwakhiwa KwebhokisiUmhlangano • Okokugcinaumhlangano womkhiqizo |
| Amasevisi Angeziwe Amanani | • Ukuthola Ingxenye • Ukupakisha nokulethwa • I-DFM • Ukupakisha kanyeukulethwa • Isampula ye-PCBA • Sebenza kabusha • I-IC Programming • Umbiko we-NPI |
| Izitifiketi zenkampani | • ISO9001 • IATF16949 • ISO13485 • 14001 |
| Izitifiketi Zomkhiqizo | • UL • RoHS • SGS • REACH |
| Amandla we-oda | • Azikho izidingo ze-MOQ (Ubuningi be-oda obuncane) |
| Inqubo Yokuhlola | QC ukuhlolwa manual SPI(Solder Namathisela Ukuhlolwa)I-X-ray • FAI (isihloko sokuqala ukuhlolwa) Ukuhlolwa kokwethembeka kwe-ICT FCT Ukuguga |
| I-FOB Port | I-Shenzhen |
| Isisindo ngeyunithi ngayinye | 150.0 amagremu |
| Ikhodi ye-HTS | 3824.99.70 00 |
| Thekelisa I-Carton Dimensions L/W/H | 53.0 x 29.0 x 37.0 Amasentimitha |
| Isikhathi esiholayo | izinsuku 14-21 |
| Ubukhulu ngeyunithi ngayinye | 15.0 x 10.0 x 3.0 Amasentimitha |
| Amayunithi ngeKhathoni Lokuthekelisa ngalinye | 100.0 |
| Thumela Isisindo Sekhathoni | 13.0 kg |