Ikhwalithi ephezulu ye-ENIG PCB yezinto zezokwelapha Indawo yokuvikela amasosha e-Aerospace Ugqinsi lwegolide 1u”-3u”

Senza izimboni ze-pcb ne-pcb zokuhlanganisa i-one-stop service. inabantu abangama-400 sebebonke. U-20% ukhuphula umthamo wokuthengisa unyaka ngamunye. Ukukhiqizwa okungu-70% konke kusuka phesheya kwezilwandle. senza u-1-12layer.FR4.CEM-1.CEM-3.HDI. AL impahla. samukelekile ama-oda wama-prototypes. amasampula pcb evamile mayelana 3days can deliverysingakwazi ukuthumela kungakapheli 12hour yakho noma 24hour ukhokhe izindleko eziphuthumayo. pcba prototypes mayelana 1day can kwezidingo. smt kanye ne-dip kanye nezingxenye zezandla konke okungakwenza. hlanganisa izingxenye ezingu-0201.BGA. 100%Isithembiso sekhwalithi. ngenxa ye-Fly probe. Ishalofu lokuhlola i-E.X-RAY.AOI. Ukuhlolwa komsebenzi webhodi ngalinye. singenza isakhiwo sokuklama noma sikopishe ibhodi uma kungekho ifayela le-pcb gerber kanye nohlu lwe-bom. ungathumela okwandulele kwakho isampula yangempela kithi uma unakho. sicela unikeze umdwebo we-shematic. usayizi wohlaka. izingxenye zedatha uma kungekho amasampula eqiniso. siqinisekile ukulungisa noma ukukhiqiza kabusha noma ukuthwala izinkinga zekhwalithi uma ikhwalithi yenza izinhlangothi zethu. noma iyiphi impendulo izophendulwa phakathi namahora angu-5. sine-ISO9001.TS16949.SGS.UL. Isitifiketi se-ROHS. Ngibheke phambili ukuzwa okuvela kuwe maduze. wamukele isipho sakho maduze.

Imingcele yezobuchwepheshe
•Material:FR-4,CEM-3,CEM-1,AL ,HDI,Halogen-free , Ceramic board
•Min Solder Mask bridge:0.1mm
•Min/max Solder Mask ukujiya:10um-25um
•I-Min hold solder diameter:0.1mm(uhlangothi olulodwa)
•Ukubekezelela Ububanzi:PTH ±0.076mm NPTH ±0.05mm
•Ukuhlala Ngemaski (yebo/cha):Yebo
•Izibalo Zesendlalelo:1-12 IMIDLALO
•Ubukhulu Bebhodi:0.4mm—3.5mm
•Ukubekezelela Ukuqina(t≥0.8mm):0.8 +/-0.1mm;1.2-1.6 +/-0.13mm;2.4 +/-0.18mm;3.2 +/-0.25mm
•Ukubekezelela Ukuqina( T<0.8mm):0.4-0.6 +/-0.1mm
•Ulayini Obuncane (0,5OZ):0.10mm(wokunamathisela igolide):Isikhala Esincane (0,5OZ)0.10mm(sokufaka igolide)
•I-Minimum Line (1OZ):0.15mm:I-Minimum Line (2OZ):0.20mm
•Ulayini Obuncane (3OZ):0.25mm:Isikhala Esincane (1OZ):0.15mm
•Isikhala Esincane (2OZ):0.20mm
•Isikhala Esincane (3OZ):0.25mm
•Ugqinsi Lwethusi Lwe-Out:0.5-2OZ
•I-Inner Layer yethusi Ukuqina:0.5-2OZ
•I-Min Drilling Hole (Kuqediwe):0.25mm
•Iringi ye-Annular:0.1mm Ukubhaliswa:±0.1mm
•Ukubukeka Kwesilinganiso:Ngezimbobo - 8:1
• Umbala Wemaski ye-Solder:Okuluhlaza, omnyama, obomvu, omhlophe. Okuncane. I-Solder Mask Clearance: 0.05mm
•Umbala we-legend:Okuluhlaza, omhlophe, obomvu, ophuzi, omnyama.
•Ubukhulu Bebhodi Usayizi:500x600mm
•I-Twist and Bow (yokuhlangana kwe-SMT):≤0.75%
Ubukhulu Tin/Lead HASL:5-25um