Izendlalelo | 1-2 Izendlalelo |
Aqede Ukuqina | 16-134mil (0.4mm-3.4mm) |
Ubukhulu. Ubukhulu | 500mm *1200mm |
Ukuqina Kwethusi | 35um, 70um,1 kuya ku-10oZ |
Ububanzi/Isikhala Somugqa Omncane | 4mil (0.1mm) |
I-Min Finished Hole size | 0.95mm |
Okuncane. Usayizi Wokubhoboza | 1.00mm |
Ubukhulu. Usayizi Wokubhoboza | 6.5mm |
Iqedile Ukubekezelela Usayizi Wembobo | ±0.050mm |
I-Aperture Position Precision | ±0.076mm |
Ubuncane besayizi ye-SMT PAD | 0.4mm±0.1mm |
I-Min.Solder Mask PAD | 0.05mm(2mil) |
Ikhava Yemaski Encane | 0.05mm(2mil) |
I-solder mask Ukuqina | > 12 um |
Surface Finishing | HAL, HAL Lead free,OSP, Immersion Gold, njll |
Ubukhulu be-HAL | 5-12 um |
Ukucwiliswa Kwegolide Ukujiya | 1-3 mil |
Ubukhulu befilimu ye-OSP | I-ENTEK PLUS HT: 0.3-0.5um; F2:0.15-0.3um |
Ukuqeda Uhlaka | Umzila & Ukushaya; Ukuchezuka Okunembayo ±0.10mm |
I-Thermal Conductivity | 1.0 kuya ku-12w/mk |
I-FOB Port | I-Shenzhen |
Thekelisa I-Carton Dimensions L/W/H | 36 x 26 x 25 Amasentimitha |
Isikhathi esiholayo | 3-7 izinsuku |
Amayunithi ngeKhathoni Lokuthekelisa ngalinye | 5.0 |
Thumela Isisindo Sekhathoni | 18 kg |