Ingabe uyayiqonda imithetho emibili ye-PCB yokuklama laminated?

Okulandelayo yisibonelo sesitaki sezendlalelo ezimbili kuya kweziyisishiyagalombili:

• Ibhodi le-PCB elisohlangothini olulodwa kanye nebhodi le-PCB elinohlangothi olukabili elaminate

Ezingqimbeni ezimbili, ngoba inani lezendlalelo lincane, ayikho inkinga ye-lamination.Ukulawulwa kwemisebe ye-EMI kucatshangelwa ikakhulukazi kusuka kuzintambo kanye nesakhiwo;

Ukuhambisana kwe-electromagnetic kwe-single - layer kanye ne-double - layer plate kuya kugqama kakhulu.Isizathu esiyinhloko salesi senzakalo ukuthi indawo ye-loop yesignali inkulu kakhulu, engakhiqizi nje imisebe ye-electromagnetic enamandla, kodwa futhi yenza isifunda sizwele ekuphazamisekeni kwangaphandle.Indlela elula yokuthuthukisa ukuhambisana kwe-electromagnetic komugqa ukunciphisa indawo eyiluphu yesiginali ebalulekile.

Isignali ebucayi: Ngokombono wokuhambisana kukazibuthe, isignali ebucayi ibhekisela ikakhulukazi kusignali ekhiqiza imisebe enamandla futhi ezwelayo emhlabeni wangaphandle.Amasignali angakhiqiza imisebe enamandla ngokuvamile amasignali ezikhathi ezithile, njengamasiginali aphansi amawashi noma amakheli.Amasignali azwelayo okuphazamisa yilawo anamazinga aphansi amasignali e-analog.

Amapuleti ongqimba olulodwa nakabili ngokuvamile asetshenziswa kumiklamo yokulingisa ifrikhwensi engaphansi kuka-10KHz:

1) Hambisa izintambo zamandla kungqimba olufanayo ngendlela ekhanyayo, futhi unciphise isamba sobude bemigqa;

2) Lapho uhamba ugesi kanye nocingo oluphansi, eduze komunye nomunye;Beka intambo yaphansi eduze kwentambo yesiginali yokhiye eduze ngangokunokwenzeka.Ngakho-ke, kwakhiwa indawo encane ye-loop futhi ukuzwela kwemisebe yemodi ehlukile ekuphazamiseni kwangaphandle kuyancishiswa.Lapho ucingo oluphansi lwengezwa eduze kwentambo yesignali, kwakheka isekethe enendawo encane kakhulu, futhi isignali yamanje kufanele ihanjiswe kulo mjikelezo kunenye indlela yaphansi.

I-3) Uma ibhodi lesifunda elinezingqimba ezimbili, lingaba ngakolunye uhlangothi lwebhodi lesifunda, eduze nomugqa wesignali ngezansi, eduze kwendwangu yesignali yendwangu yocingo oluphansi, umugqa obanzi ngangokunokwenzeka.Indawo yesifunda ephumela ilingana nobukhulu bebhodi lesifunda eliphindwe ngobude bomugqa wesignali.

• B. Ukufakwa kwezingqimba ezine 

1. Sig-gnd (PWR)-PWR (GND)-SIG; 

2. GND-SIG(PWR)-SIG(PWR)-GND; 

Kuyo yomibili le miklamo enama-laminated, inkinga engaba khona iwugqinsi lwepuleti elivamile elingu-1.6mm (62mil).Isikhala sezendlalelo sizoba sikhulu, hhayi nje kuphela esivumela ukulawula ukuthintana, ukuhlangana kwe-interlayer nokuvikela;Ikakhulukazi, isikhala esikhulu phakathi kwestrata sokuphakela amandla sinciphisa amandla epuleti futhi asihambisani nokuhlunga umsindo.

Ngohlelo lokuqala, luvame ukusetshenziswa esimweni senani elikhulu lama-chips ebhodini.Lolu hlelo lungathola ukusebenza okungcono kwe-SI, kodwa ukusebenza kwe-EMI akukuhle kangako, okulawulwa kakhulu yizintambo neminye imininingwane.Ukunakwa okuyinhloko: Ukwakheka kufakwa kungqimba lwesignali yongqimba lwesignali oluminyene kakhulu, oluvumela ukumuncwa nokucindezelwa kwemisebe;Khulisa indawo yamapuleti ukuze ubonise umthetho we-20H.

Ngohlelo lwesibili, kuvame ukusetshenziswa lapho ubukhulu be-chip ebhodini buphansi ngokwanele futhi kunendawo eyanele ezungeze i-chip ukubeka amandla adingekayo e-copper coating.Kulolu hlelo, ungqimba lwangaphandle lwe-PCB luyi-stratum, futhi izingqimba ezimbili ezimaphakathi ziyizingqimba zesignali/zamandla.Ukunikezwa kwamandla kwesendlalelo sesignali kuhanjiswa ngomugqa obanzi, ongenza ukuthi indlela yokuphamba kwamandla kagesi ibe phansi, futhi i-impedance yendlela yesignali ye-microstrip nayo iphansi, futhi ingavikela imisebe yesignali yangaphakathi ngokusebenzisa ngaphandle. ungqimba.Kusukela endaweni yokulawula ye-EMI, lesi yisakhiwo se-PCB esendlalelo esingcono kakhulu esingu-4 esitholakalayo.

Ukunakwa okuyinhloko: izingqimba ezimbili ezimaphakathi zesignali, ukuhlukaniswa kwamandla okuhlanganisa ungqimba kufanele kuvulwe, isiqondiso somugqa siqondile, gwema i-crosstalk;Indawo yephaneli yokulawula efanele, ebonisa imithetho ye-20H;Uma i-impedance yezintambo kufanele ilawulwe, beka ngokucophelela izintambo ngaphansi kweziqhingi zethusi zokunikezwa kwamandla kanye nomhlabathi.Ukwengeza, ukunikezwa kwamandla noma ukubeka ithusi kufanele kuxhunywe ngangokunokwenzeka ukuze kuqinisekiswe i-DC kanye nokuxhumeka kwe-frequency ephansi.

• C. Ukufakwa kwezingqimba eziyisithupha zamapuleti

Ngokuklama kwe-chip density ephezulu kanye nemvamisa yewashi ephezulu, ukwakheka kwebhodi le-6-layer kufanele kucatshangelwe.Kunconywa indlela ye-lamination:

1.SIG-GND-SIG-PWR-GND-SIG; 

Kulolu hlelo, uhlelo lwe-lamination lufinyelela ubuqotho besignali enhle, ngesendlalelo sesignali esiseduze nesendlalelo esiphansi, isendlalelo samandla esihlanganiswe nesendlalelo esiphansi, ukuvinjelwa kwesendlalelo ngasinye somzila kungalawulwa kahle, futhi zombili izingqimba zingakwazi ukumunca imigqa kazibuthe kahle. .Ngaphezu kwalokho, inganikeza indlela engcono yokubuya kwesendlalelo ngasinye sesignali ngaphansi kwesimo sokunikezwa kwamandla okuphelele nokubunjwa.