Inqubo yokukhiqiza ye-PCBA enemininingwane (kuhlanganise nenqubo ye-SMT), ngena futhi ubone!
01."Ukugeleza Kwenqubo ye-SMT"
I-Reflow welding ibhekisela kunqubo yokubhula ethambile eqaphela uxhumano lwemishini nogesi phakathi kwesiphetho sokushisela sengxenye ehlanganiswe phezulu noma iphinikhodi nephedi ye-PCB ngokuncibilikisa i-solder paste ephrintwe ngaphambili kuphedi ye-PCB. Ukugeleza kwenqubo kungukuthi: ukuphrinta i-solder paste - patch - reflow welding, njengoba kuboniswe esithombeni esingezansi.
1. Ukuphrinta kokunamathisela kwe-solder
Inhloso ukusebenzisa inani elifanele le-solder paste ngokulinganayo kuphedi ye-solder ye-PCB ukuze kuqinisekiswe ukuthi izingxenye ze-patch kanye nephedi ye-solder ehambisanayo ye-PCB zigeleza kabusha zishiselwe ukuze kuzuzwe ukuxhumana okuhle kukagesi futhi zibe namandla anele okusebenza. Ungaqinisekisa kanjani ukuthi i-solder paste isetshenziswa ngokulinganayo ku-pad ngayinye? Sidinga ukwenza insimbi enezikhala. I-solder paste ihlanganiswe ngokulinganayo ku-solder pad ngayinye ngaphansi kwesenzo se-scraper ngokusebenzisa izimbobo ezihambisanayo ku-mesh yensimbi. Izibonelo ze-steel mesh diagram zikhonjiswe emfanekisweni olandelayo.
Umdwebo wokuphrinta we-solder ukhonjiswe esithombeni esilandelayo.
I-PCB yokunamathisela ephrintiwe ye-solder iboniswa esithombeni esilandelayo.
2. Isiqephu
Le nqubo iwukusebenzisa umshini wokukhweza ukuze ukhweze ngokunembile izingxenye ze-chip endaweni ehambisanayo endaweni ye-PCB yokunamathisela kwe-solder ephrintiwe noma i-patch glue.
Imishini ye-SMT ingahlukaniswa ngezinhlobo ezimbili ngokwemisebenzi yayo:
Umshini onesivinini esikhulu: ofanele ukukhwezwa kwenani elikhulu lezingxenye ezincane: njengama-capacitor, ama-resistors, njll., nawo angafaka ezinye izingxenye ze-IC, kodwa ukunemba kunqunyelwe.
Umshini we-B Universal: ulungele ukukhweza ubulili obuhlukile noma izingxenye ezinembayo eziphezulu: njenge-QFP, BGA, SOT, SOP, PLCC nokunye.
Umdwebo wemishini yomshini we-SMT uboniswa esithombeni esilandelayo.
I-PCB ngemva kwepheshi iboniswa emfanekisweni olandelayo.
3. Reflow welding
I-Reflow Soldring iwukuhumusha ngokwezwi nezwi kwe-English Reflow soldring, okuwukuxhumana kwemishini nogesi phakathi kwezingxenye zokuhlanganisa ezingaphezulu kanye nephedi ye-solder ye-PCB ngokuncibilikisa i-solder pad ebhodini lesifunda solder pad, kwakha isekethe kagesi.
I-Reflow welding iyinqubo eyinhloko ekukhiqizweni kwe-SMT, futhi ukulungiselelwa kwejika lokushisa okunengqondo kuyisihluthulelo sokuqinisekisa ikhwalithi yokushisela kabusha. Amajika okushisa angalungile azodala izinkinga zokushisela i-PCB njengokushisela okungaphelele, ukushisela okubonakalayo, i-warping yengxenye, namabhola e-solder eqile, okuzothinta ikhwalithi yomkhiqizo.
Umdwebo wemishini yesithando somlilo we-welding uboniswa esithombeni esilandelayo.
Ngemva kwesithando sokugeleza kabusha, i-PCB egcwaliswe ngokushisela kabusha iboniswa esithombeni esingezansi.
